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上海科技大学傅旻帆学术报告

来源: 点击: 时间: 2018年05月30日 08:55

报告时间:2018年5月30日上午10:00-11:00

报告地点中南大学校本部民主楼210会议室

报告题目Megahertz wireless power transfer: from 2D to 3D

报告人:Prof. Minfan Fu/傅旻帆助理教授、研究员,上海科技大学信息学院。

Speaker: Minfan Fu

报告摘要:Wireless power transfer (WPT) using inductive resonance has become increasingly popular in recent years. Now this emerging technology is being applied to charge wearable devices, cellphones, household appliances, electric vehicles, and even very high-power trains. Currently WPT working at kilohertz shows rapid improvement thanks to the new development in power electronics. Meanwhile, it is attractive to further increase the resonance frequency such as to several megahertz (MHz) especially for a higher level of spatial freedom, namely a longer transfer distance and higher tolerance to coupling coil misalignment. A higher frequency also helps to build more compact and lighter WPT systems. Therefore, WPT systems working at MHz are now widely considered to be suitable for low-power applications. This presentation will provide an overview of megahertz wireless power transfer. It will discuss the general issues and solutions for a 2D WPT system, such as: maximum efficiency point tracking, multiple-coils coupling mechanism, cross coupling compensation, and power distribution among multiple receivers. Finally, a 3D WPT system is proposed to further improve the user experience for charging small portable devices.

报告人简介:Dr. Minfan Fu received his bachelor, master, and doctoral degrees from University of Michigan and Shanghai Jiao Tong University Joint Institute at 2010, 2013, and 2016, respectively. From 2016 to 2018, he worked as a postdoctoral researcher at the Virginia Tech. Center for Power Electronics Systems (CPES). He joined the School of Information Science and Technology, Shanghai Tech University as an assistant professor in Mar. 2018. His main interests include wireless power transfer, high-frequency power conversion, high-frequency magnetics, and the application of wide-bandgap devices. He has published over 30 papers on top IEEE journals and conferences.


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